
FutureTherm official partner of thermoheld GmbH
Your reliable partner for all questions regarding infrared heating systems. The product range is healthy for living, invisible, flexible, economical and individually controllable. Electrically heated thermoheld products create heat sources exactly where they are needed. This opens up completely new possibilities for home builders and modernizers when it comes to living space design. Starting with the quick-to-process fiberglass fleece thermoheld •FLEX• through to the ultra-thin underfloor heating thermoheld •BODEN•. If large areas are to be heated with infrared heat, thermoheld •WAND• is the heating system of choice. The fiberglass grid thermoheld •TILE• can either temper or heat surfaces.
thermoheld •BODEN• is a modern, ultra-thin underfloor heating. With a construction height of 0.5 millimeters, the electrically heated fleece structure is so slim that it can be laid directly under the floor covering. In contrast to other infrared systems on the market, thermoheld •BODEN• works with safe low-voltage technology (24 V). The comfortable radiant heat not only warms your feet but the entire room within a very short time.
thermoheld •BODEN• advantages at a glance:
Comfortable radiant heat Low installation height of 0.5 mm Easy to process fleece sheet Fast response time - needs-based control via programmable thermostat Ideal as underfloor heating Highly conductive thanks to innovative carbon technology Safe operation with low voltage (24 V)
designed as a complete system - all components for commissioning contain water-based, solvent-free and low-pollutant coating*
thermoheld •BODEN• is a thin fleece structure on which an electrically conductive carbon coating is applied. The electrical current is conducted into the heating foil via two copper strips on the long sides, which serve as electrodes, and converted into heat. Thermoheld •BODEN• is operated with a safe 24 V mains voltage.
A modern thermostat takes over the needs-based control. thermoheld •BODEN• is available with lamination.